Xilinx - XA3SD3400A-FGG676I

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XA3SD3400A-FGG676I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XA3SD3400A-FGG676I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: RECTANGULAR;
Datasheet XA3SD3400A-FGG676I Datasheet
In Stock424
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 5968 CLBS, 3400000 Gates
Maximum Seated Height: 2.44 mm
No. of Inputs: 469
Surface Mount: Yes
No. of Outputs: 469
Position Of Terminal: Bottom
No. of Terminals: 676
No. of Equivalent Gates: 3400000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B676
Package Shape: Rectangular
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
No. of Logic Cells: 53712
No. of CLBs: 5968
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA676,26X26,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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