Xilinx - XA6SLX16-2CSG225Q

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XA6SLX16-2CSG225Q by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XA6SLX16-2CSG225Q
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
Datasheet XA6SLX16-2CSG225Q Datasheet
In Stock263
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of Inputs: 160
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 160
Position Of Terminal: Bottom
No. of Terminals: 225
Package Style (Meter): Grid Array, Fine Pitch
Screening Level: AEC-Q100
JESD-30 Code: S-PBGA-B225
Maximum Clock Frequency: 62.5 MHz
Package Shape: Square
Package Code: FBGA
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
No. of Logic Cells: 14579
JESD-609 Code: e1
Qualification: No
Package Equivalence Code: BGA225,15X15,32
Finishing Of Terminal Used: Tin Silver Copper
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2,2.5/3.3 V
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