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Manufacturer | Xilinx |
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Manufacturer's Part Number | XA6SLX45-2FG676I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn63Pb37); |
Datasheet | XA6SLX45-2FG676I Datasheet |
In Stock | 451 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | Plastic/Epoxy |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
No. of Inputs: | 358 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 358 |
Position Of Terminal: | Bottom |
No. of Terminals: | 676 |
Package Style (Meter): | Grid Array |
Screening Level: | AEC-Q100 |
JESD-30 Code: | S-PBGA-B676 |
Maximum Clock Frequency: | 667 MHz |
Package Shape: | Square |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 3 |
Programmable IC Type: | FPGA |
Technology Used: | CMOS |
No. of Logic Cells: | 43661 |
JESD-609 Code: | e0 |
Qualification: | No |
Package Equivalence Code: | BGA676,26X26,40 |
Finishing Of Terminal Used: | Tin/Lead (Sn63Pb37) |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 225 °C (437 °F) |
Power Supplies (V): | 1.2,1.2/3.3,2.5/3.3 V |