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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XA6SLX45-3CSG324Q |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER; |
| Datasheet | XA6SLX45-3CSG324Q Datasheet |
| In Stock | 1,049 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | Plastic/Epoxy |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| No. of Inputs: | 218 |
| Sub-Category: | Field Programmable Gate Arrays |
| Surface Mount: | Yes |
| No. of Outputs: | 218 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 324 |
| Package Style (Meter): | Grid Array, Fine Pitch |
| Screening Level: | AEC-Q100 |
| JESD-30 Code: | S-PBGA-B324 |
| Maximum Clock Frequency: | 62.5 MHz |
| Package Shape: | Square |
| Package Code: | FBGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Programmable IC Type: | FPGA |
| No. of Logic Cells: | 43661 |
| JESD-609 Code: | e1 |
| Qualification: | No |
| Package Equivalence Code: | BGA324,18X18,32 |
| Finishing Of Terminal Used: | Tin Silver Copper |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | .8 mm |
| Peak Reflow Temperature (C): | 260 °C (500 °F) |
| Power Supplies (V): | 1.2,2.5/3.3 V |









