Xilinx - XA7Z010-1CLG225Q

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XA7Z010-1CLG225Q by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XA7Z010-1CLG225Q
Description MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet XA7Z010-1CLG225Q Datasheet
In Stock349
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Ultraviolet Erasable: N
Maximum Seated Height: 1.5 mm
Sub-Category: Other uPs/uCs/Peripheral ICs
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 225
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B225
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: LFBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: MICROPROCESSOR CIRCUIT
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA225,15X15,32
Length: 13 mm
Terminal Pitch: .8 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1,1.8
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Pricing (USD)

Qty. Unit Price Ext. Price
349 $98.340 $34,320.660

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