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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XA7Z030-1FBG484Q |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | XA7Z030-1FBG484Q Datasheet |
| In Stock | 489 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Ultraviolet Erasable: | N |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.54 mm |
| Sub-Category: | Other uPs/uCs/Peripheral ICs |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| No. of Terminals: | 484 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B484 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | BGA |
| Width: | 23 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA484,22X22,40 |
| Length: | 23 mm |
| Peak Reflow Temperature (C): | 250 |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | AUTOMOTIVE |
| Power Supplies (V): | 1,1.8 |
