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Manufacturer | Xilinx |
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Manufacturer's Part Number | XAF04SVOG20Q |
Description | CONFIGURATION MEMORY; Temperature Grade: AUTOMOTIVE; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; |
Datasheet | XAF04SVOG20Q Datasheet |
In Stock | 85 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .001 Amp |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Maximum Supply Current: | 10 mA |
Terminal Finish: | Matte Tin (Sn) |
No. of Terminals: | 20 |
Maximum Clock Frequency (fCLK): | 33 MHz |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Screening Level: | AEC-Q100 |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-G20 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 125 Cel |
Package Code: | TSSOP |
Moisture Sensitivity Level (MSL): | 3 |
Memory Density: | 4194304 bit |
Memory IC Type: | CONFIGURATION MEMORY |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Type: | NOR TYPE |
Qualification: | Not Qualified |
Package Equivalence Code: | TSSOP20,.25 |
Peak Reflow Temperature (C): | 260 |
Parallel or Serial: | SERIAL |
Terminal Pitch: | .635 mm |
Temperature Grade: | AUTOMOTIVE |
Power Supplies (V): | 1.8,1.8/3.3 |