Image shown is a representation only.
| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XAF04SVOG20Q |
| Description | CONFIGURATION MEMORY; Temperature Grade: AUTOMOTIVE; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; |
| Datasheet | XAF04SVOG20Q Datasheet |
| In Stock | 1,106 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .001 Amp |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 10 mA |
| Terminal Finish: | Matte Tin (Sn) |
| No. of Terminals: | 20 |
| Maximum Clock Frequency (fCLK): | 33 MHz |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G20 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | TSSOP |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 4194304 bit |
| Memory IC Type: | CONFIGURATION MEMORY |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP20,.25 |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | .635 mm |
| Temperature Grade: | AUTOMOTIVE |
| Power Supplies (V): | 1.8,1.8/3.3 |
