Xilinx - XAZU3EG-L1SBVA484I

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XAZU3EG-L1SBVA484I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XAZU3EG-L1SBVA484I
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;
Datasheet XAZU3EG-L1SBVA484I Datasheet
In Stock276
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .72 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.61 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Terminals: 484
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Length: 19 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B484
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Peak Reflow Temperature (C): 250
Package Code: FBGA
Width: 19 mm
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Moisture Sensitivity Level (MSL): 3
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