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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC17128EVOG8C |
Description | CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30; |
Datasheet | XC17128EVOG8C Datasheet |
In Stock | 42 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .00005 Amp |
Organization: | 128KX1 |
Output Characteristics: | 3-STATE |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.1938 mm |
Minimum Supply Voltage (Vsup): | 4.75 V |
Sub-Category: | OTP ROMs |
Surface Mount: | YES |
Maximum Supply Current: | 10 mA |
Terminal Finish: | Matte Tin (Sn) |
No. of Terminals: | 8 |
Maximum Clock Frequency (fCLK): | 15 MHz |
No. of Words: | 131072 words |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, THIN PROFILE |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-G8 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 70 Cel |
Package Code: | TSOP2 |
Width: | 3.937 mm |
Moisture Sensitivity Level (MSL): | 3 |
Input/Output Type: | COMMON |
Memory Density: | 131072 bit |
Memory IC Type: | CONFIGURATION MEMORY |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 1 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | TSOP8,.25 |
Length: | 4.9276 mm |
No. of Words Code: | 128K |
Nominal Supply Voltage / Vsup (V): | 5 |
Additional Features: | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
Peak Reflow Temperature (C): | 260 |
Parallel or Serial: | SERIAL |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | COMMERCIAL |
Maximum Supply Voltage (Vsup): | 5.25 V |
Power Supplies (V): | 5 |