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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC17256DDD8B |
| Description | CONFIGURATION MEMORY; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel; |
| Datasheet | XC17256DDD8B Datasheet |
| In Stock | 245 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC, GLASS-SEALED |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 256KX1 |
| Output Characteristics: | 3-STATE |
| Maximum Seated Height: | 5.08 mm |
| Minimum Supply Voltage (Vsup): | 4.5 V |
| Sub-Category: | OTP ROMs |
| Surface Mount: | NO |
| Maximum Supply Current: | 10 mA |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 8 |
| Maximum Clock Frequency (fCLK): | 12 MHz |
| No. of Words: | 262144 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Screening Level: | MIL-STD-883 Class B |
| Technology: | CMOS |
| JESD-30 Code: | R-GDIP-T8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | DIP |
| Width: | 7.62 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Input/Output Type: | COMMON |
| Memory Density: | 262144 bit |
| Memory IC Type: | CONFIGURATION MEMORY |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -55 Cel |
| Memory Width: | 1 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP8,.3 |
| Length: | 10.16 mm |
| No. of Words Code: | 256K |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | MILITARY |
| Maximum Supply Voltage (Vsup): | 5.5 V |
| Power Supplies (V): | 5 |
