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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC1736DDDG8M |
Description | MEMORY CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel; |
Datasheet | XC1736DDDG8M Datasheet |
In Stock | 193 |
NAME | DESCRIPTION |
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Package Body Material: | CERAMIC, GLASS-SEALED |
Organization: | 36288X1 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 5.08 mm |
Minimum Supply Voltage (Vsup): | 4.5 V |
Surface Mount: | NO |
No. of Terminals: | 8 |
No. of Words: | 36288 words |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | CMOS |
JESD-30 Code: | R-GDIP-T8 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 125 Cel |
Package Code: | DIP |
Width: | 7.62 mm |
Memory Density: | 36288 bit |
Memory IC Type: | MEMORY CIRCUIT |
Minimum Operating Temperature: | -55 Cel |
Memory Width: | 1 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Length: | 10.16 mm |
No. of Words Code: | 36288 |
Nominal Supply Voltage / Vsup (V): | 5 |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | MILITARY |
Maximum Supply Voltage (Vsup): | 5.5 V |