Image shown is a representation only.
| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC1736EVO8C |
| Description | CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Additional Features: USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS; |
| Datasheet | XC1736EVO8C Datasheet |
| In Stock | 1,625 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 36288X1 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.1938 mm |
| Minimum Supply Voltage (Vsup): | 4.75 V |
| Sub-Category: | OTP ROMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 10 mA |
| Terminal Finish: | Tin/Lead (Sn85Pb15) |
| No. of Terminals: | 8 |
| Maximum Clock Frequency (fCLK): | 10 MHz |
| No. of Words: | 36288 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | TSOP2 |
| Width: | 3.937 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Input/Output Type: | COMMON |
| Memory Density: | 36288 bit |
| Memory IC Type: | CONFIGURATION MEMORY |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 1 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSOP8,.25 |
| Length: | 4.9276 mm |
| No. of Words Code: | 36288 |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Additional Features: | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
| Peak Reflow Temperature (C): | 225 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 5.25 V |
| Power Supplies (V): | 5 |
