Image shown is a representation only.
| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC1764-PD8C |
| Description | CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | XC1764-PD8C Datasheet |
| In Stock | 143 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .0005 Amp |
| Organization: | 64KX1 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | OTP ROMs |
| Surface Mount: | NO |
| Maximum Supply Current: | 10 mA |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 8 |
| Maximum Clock Frequency (fCLK): | 2.5 MHz |
| No. of Words: | 65536 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDIP-T8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | DIP |
| Moisture Sensitivity Level (MSL): | 1 |
| Input/Output Type: | COMMON |
| Memory Density: | 65536 bit |
| Memory IC Type: | CONFIGURATION MEMORY |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP8,.3 |
| No. of Words Code: | 64K |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Peak Reflow Temperature (C): | 225 |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 5 |
