Xilinx - XC1765EDD8M

XC1765EDD8M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC1765EDD8M
Description CONFIGURATION MEMORY; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 1;
Datasheet XC1765EDD8M Datasheet
In Stock80
NAME DESCRIPTION
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Maximum Standby Current: .0015 Amp
Organization: 64KX1
Output Characteristics: 3-STATE
Maximum Seated Height: 5.08 mm
Minimum Supply Voltage (Vsup): 4.5 V
Sub-Category: OTP ROMs
Surface Mount: NO
Maximum Supply Current: 10 mA
Terminal Finish: TIN LEAD
No. of Terminals: 8
Maximum Clock Frequency (fCLK): 5 MHz
No. of Words: 65536 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-CDIP-T8
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Width: 7.62 mm
Input/Output Type: COMMON
Memory Density: 65536 bit
Memory IC Type: CONFIGURATION MEMORY
JESD-609 Code: e0
Minimum Operating Temperature: -55 Cel
Memory Width: 1
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: DIP8,.3
Length: 10.16 mm
No. of Words Code: 64K
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: SERIAL
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
Maximum Supply Voltage (Vsup): 5.5 V
Power Supplies (V): 5
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