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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC1765L-DD8I |
Description | CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 65536 words; |
Datasheet | XC1765L-DD8I Datasheet |
In Stock | 224 |
NAME | DESCRIPTION |
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Package Body Material: | CERAMIC |
Maximum Standby Current: | .0015 Amp |
Organization: | 64KX1 |
Output Characteristics: | 3-STATE |
Sub-Category: | OTP ROMs |
Surface Mount: | NO |
Maximum Supply Current: | 5 mA |
No. of Terminals: | 8 |
Maximum Clock Frequency (fCLK): | 2.5 MHz |
No. of Words: | 65536 words |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | CMOS |
JESD-30 Code: | R-XDIP-T8 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 85 Cel |
Package Code: | DIP |
Input/Output Type: | COMMON |
Memory Density: | 65536 bit |
Memory IC Type: | CONFIGURATION MEMORY |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP8,.3 |
No. of Words Code: | 64K |
Nominal Supply Voltage / Vsup (V): | 3.3 |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3 |