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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC17S05PDG8C |
Description | MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; |
Datasheet | XC17S05PDG8C Datasheet |
In Stock | 415 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 53984X1 |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 4.5974 mm |
Minimum Supply Voltage (Vsup): | 4.75 V |
Surface Mount: | NO |
Terminal Finish: | Matte Tin (Sn) |
No. of Terminals: | 8 |
No. of Words: | 53984 words |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | CMOS |
JESD-30 Code: | R-PDIP-T8 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 70 Cel |
Package Code: | DIP |
Width: | 7.62 mm |
Moisture Sensitivity Level (MSL): | 1 |
Memory Density: | 53984 bit |
Memory IC Type: | MEMORY CIRCUIT |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 1 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Length: | 9.3599 mm |
No. of Words Code: | 53984 |
Nominal Supply Voltage / Vsup (V): | 5 |
Peak Reflow Temperature (C): | 250 |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | COMMERCIAL |
Maximum Supply Voltage (Vsup): | 5.25 V |