Xilinx - XC17S15XLVO8I

XC17S15XLVO8I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC17S15XLVO8I
Description CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 225;
Datasheet XC17S15XLVO8I Datasheet
In Stock246
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 197728X1
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 8
No. of Words: 197728 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PDSO-G8
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TSOP
Width: 3.9 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 197728 bit
Memory IC Type: CONFIGURATION MEMORY
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Memory Width: 1
No. of Functions: 1
Qualification: Not Qualified
Length: 4.9 mm
No. of Words Code: 197728
Nominal Supply Voltage / Vsup (V): 3.3
Peak Reflow Temperature (C): 225
Parallel or Serial: SERIAL
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V
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Pricing (USD)

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