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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC17S200APDG8I |
| Description | CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Length: 9.3599 mm; |
| Datasheet | XC17S200APDG8I Datasheet |
| In Stock | 681 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .001 Amp |
| Organization: | 1335840X1 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 4.5974 mm |
| Minimum Supply Voltage (Vsup): | 3 V |
| Sub-Category: | OTP ROMs |
| Surface Mount: | NO |
| Maximum Supply Current: | 15 mA |
| Terminal Finish: | Matte Tin (Sn) |
| No. of Terminals: | 8 |
| No. of Words: | 1335840 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDIP-T8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | DIP |
| Width: | 7.62 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Input/Output Type: | COMMON |
| Memory Density: | 1335840 bit |
| Memory IC Type: | CONFIGURATION MEMORY |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 1 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP8,.3 |
| Length: | 9.3599 mm |
| No. of Words Code: | 1335840 |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Peak Reflow Temperature (C): | 250 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 3.3 |
