Xilinx - XC17V04PCG20I

XC17V04PCG20I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC17V04PCG20I
Description CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Terminal Form: J BEND;
Datasheet XC17V04PCG20I Datasheet
In Stock486
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 4MX1
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 4.572 mm
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: YES
Terminal Finish: Matte Tin (Sn)
No. of Terminals: 20
No. of Words: 4194304 words
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER
Technology: CMOS
JESD-30 Code: S-PQCC-J20
Package Shape: SQUARE
Terminal Form: J BEND
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: QCCJ
Width: 8.9662 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 4194304 bit
Memory IC Type: CONFIGURATION MEMORY
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Memory Width: 1
No. of Functions: 1
Qualification: Not Qualified
Length: 8.9662 mm
No. of Words Code: 4M
Nominal Supply Voltage / Vsup (V): 3.3
Peak Reflow Temperature (C): 245
Parallel or Serial: SERIAL
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V
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