Xilinx - XC2C256-5FT256C

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XC2C256-5FT256C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2C256-5FT256C
Description FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
Datasheet XC2C256-5FT256C Datasheet
In Stock288
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 5 ns
Organization: 0 Dedicated Inputs, 184 I/O
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.55 mm
Sub-Category: Programmable Logic Devices
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 256
JTAG Boundary Scan Test: Yes
No. of I/O Lines: 184
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B256
Package Shape: Square
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: LBGA
Width: 17 mm
No. of Dedicated Inputs: 0
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial
Programmable IC Type: Flash PLD
Maximum Supply Voltage: 1.9 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)
Length: 17 mm
Form Of Terminal: Ball
In-System Programmable: Yes
Additional Features: Real Digital Design Technology
Output Function: Macrocell
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
No. of Macro Cells: 256
Power Supplies (V): 1.5/3.3,1.8 V
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