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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC2C256-7FTG256C |
Description | FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; |
Datasheet | XC2C256-7FTG256C Datasheet |
In Stock | 2,127 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.7 V |
Package Body Material: | Plastic/Epoxy |
Propagation Delay: | 7.5 ns |
Organization: | 0 Dedicated Inputs, 184 I/O |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Seated Height: | 1.55 mm |
No. of Inputs: | 184 |
Sub-Category: | Programmable Logic Devices |
Surface Mount: | Yes |
No. of Outputs: | 184 |
Position Of Terminal: | Bottom |
No. of Terminals: | 256 |
JTAG Boundary Scan Test: | Yes |
No. of I/O Lines: | 184 |
Package Style (Meter): | Grid Array, Low Profile |
JESD-30 Code: | S-PBGA-B256 |
Maximum Clock Frequency: | 108 MHz |
Package Shape: | Square |
Maximum Operating Temperature: | 70 °C (158 °F) |
Package Code: | LBGA |
Width: | 17 mm |
No. of Dedicated Inputs: | 0 |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | Commercial |
Programmable IC Type: | Flash PLD |
Maximum Supply Voltage: | 1.9 V |
Architecture: | PLA-TYPE |
Nominal Supply Voltage (V): | 1.8 |
Technology Used: | CMOS |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 °C (32 °F) |
Qualification: | No |
Package Equivalence Code: | BGA256,16X16,40 |
Finishing Of Terminal Used: | Tin Silver Copper |
Length: | 17 mm |
Form Of Terminal: | Ball |
In-System Programmable: | Yes |
Additional Features: | Real Digital Design Technology |
Output Function: | Macrocell |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 260 °C (500 °F) |
No. of Macro Cells: | 256 |
Power Supplies (V): | 1.5/3.3,1.8 V |