Image shown is a representation only.
| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC2C256-7FTG256C |
| Description | FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; |
| Datasheet | XC2C256-7FTG256C Datasheet |
| In Stock | 2,127 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.7 V |
| Package Body Material: | Plastic/Epoxy |
| Propagation Delay: | 7.5 ns |
| Organization: | 0 Dedicated Inputs, 184 I/O |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| Maximum Seated Height: | 1.55 mm |
| No. of Inputs: | 184 |
| Sub-Category: | Programmable Logic Devices |
| Surface Mount: | Yes |
| No. of Outputs: | 184 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 256 |
| JTAG Boundary Scan Test: | Yes |
| No. of I/O Lines: | 184 |
| Package Style (Meter): | Grid Array, Low Profile |
| JESD-30 Code: | S-PBGA-B256 |
| Maximum Clock Frequency: | 108 MHz |
| Package Shape: | Square |
| Maximum Operating Temperature: | 70 °C (158 °F) |
| Package Code: | LBGA |
| Width: | 17 mm |
| No. of Dedicated Inputs: | 0 |
| Moisture Sensitivity Level (MSL): | 3 |
| Other Names: |
XC2C2567FTG256C 122-1400 |
| Grading Of Temperature: | Commercial |
| Programmable IC Type: | Flash PLD |
| Maximum Supply Voltage: | 1.9 V |
| Architecture: | PLA-TYPE |
| Nominal Supply Voltage (V): | 1.8 |
| Technology Used: | CMOS |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 °C (32 °F) |
| Qualification: | No |
| Package Equivalence Code: | BGA256,16X16,40 |
| Finishing Of Terminal Used: | Tin Silver Copper |
| Length: | 17 mm |
| Form Of Terminal: | Ball |
| In-System Programmable: | Yes |
| Additional Features: | Real Digital Design Technology |
| Output Function: | Macrocell |
| Pitch Of Terminal: | 1 mm |
| Peak Reflow Temperature (C): | 260 °C (500 °F) |
| No. of Macro Cells: | 256 |
| Power Supplies (V): | 1.5/3.3,1.8 V |









