Xilinx - XC2C32-6CPG56C

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XC2C32-6CPG56C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2C32-6CPG56C
Description FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet XC2C32-6CPG56C Datasheet
In Stock318
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 6 ns
Organization: 1 Dedicated Inputs, 33 I/O
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.35 mm
Sub-Category: Programmable Logic Devices
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 56
JTAG Boundary Scan Test: Yes
No. of I/O Lines: 33
Package Style (Meter): Grid Array, Low Profile, Fine Pitch
JESD-30 Code: S-PBGA-B56
Package Shape: Square
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: LFBGA
Width: 6 mm
No. of Dedicated Inputs: 1
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial
Programmable IC Type: Flash PLD
Maximum Supply Voltage: 1.9 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA56,10X10,20
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 6 mm
Form Of Terminal: Ball
In-System Programmable: Yes
Additional Features: Real Digital Design Technology
Output Function: Macrocell
Pitch Of Terminal: .5 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
No. of Macro Cells: 32
Power Supplies (V): 1.5/3.3,1.8 V
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