Xilinx - XC2C512-10FGG324I

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XC2C512-10FGG324I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2C512-10FGG324I
Description FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC2C512-10FGG324I Datasheet
In Stock249
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 10 ns
Organization: 0 Dedicated Inputs, 270 I/O
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 2.5 mm
No. of Inputs: 270
Sub-Category: Programmable Logic Devices
Surface Mount: Yes
No. of Outputs: 270
Position Of Terminal: Bottom
No. of Terminals: 324
JTAG Boundary Scan Test: Yes
No. of I/O Lines: 270
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B324
Maximum Clock Frequency: 91 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 23 mm
No. of Dedicated Inputs: 0
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: Flash PLD
Maximum Supply Voltage: 1.9 V
Architecture: PLA-TYPE
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA324,22X22,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 23 mm
Form Of Terminal: Ball
In-System Programmable: Yes
Output Function: Macrocell
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
No. of Macro Cells: 512
Power Supplies (V): 1.5/3.3,1.8 V
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