Xilinx - XC2C64-4CPG56C

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XC2C64-4CPG56C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2C64-4CPG56C
Description FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet XC2C64-4CPG56C Datasheet
In Stock75
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 4 ns
Organization: 0 Dedicated Inputs, 45 I/O
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.35 mm
No. of Inputs: 45
Surface Mount: Yes
No. of Outputs: 45
Position Of Terminal: Bottom
No. of Terminals: 56
No. of I/O Lines: 45
Package Style (Meter): Grid Array, Low Profile, Fine Pitch
JESD-30 Code: S-PBGA-B56
Maximum Clock Frequency: 213 MHz
Package Shape: Square
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: LFBGA
Width: 6 mm
No. of Dedicated Inputs: 0
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial
Programmable IC Type: Flash PLD
Maximum Supply Voltage: 1.9 V
Architecture: PLA-TYPE
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Length: 6 mm
Form Of Terminal: Ball
Additional Features: Fast Zero Power Design Technology
Output Function: Macrocell
Pitch Of Terminal: .5 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
No. of Macro Cells: 64
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