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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC2C64A-7CP56I |
Description | FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | XC2C64A-7CP56I Datasheet |
In Stock | 22 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.7 V |
Package Body Material: | Plastic/Epoxy |
Propagation Delay: | 7.5 ns |
Organization: | 0 Dedicated Inputs, 45 I/O |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Seated Height: | 1.35 mm |
Sub-Category: | Programmable Logic Devices |
Surface Mount: | Yes |
Position Of Terminal: | Bottom |
No. of Terminals: | 56 |
JTAG Boundary Scan Test: | Yes |
No. of I/O Lines: | 45 |
Package Style (Meter): | Grid Array, Low Profile, Fine Pitch |
JESD-30 Code: | S-PBGA-B56 |
Maximum Clock Frequency: | 200 MHz |
Package Shape: | Square |
Maximum Operating Temperature: | 85 °C (185 °F) |
Package Code: | LFBGA |
Width: | 6 mm |
No. of Dedicated Inputs: | 0 |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | Industrial |
Programmable IC Type: | Flash PLD |
Maximum Supply Voltage: | 1.9 V |
Nominal Supply Voltage (V): | 1.8 |
Technology Used: | CMOS |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 °C (-40 °F) |
Qualification: | No |
Package Equivalence Code: | BGA56,10X10,20 |
Finishing Of Terminal Used: | Tin Lead |
Length: | 6 mm |
Form Of Terminal: | Ball |
In-System Programmable: | Yes |
Additional Features: | Real Digital Design Technology |
Output Function: | Macrocell |
Pitch Of Terminal: | .5 mm |
Peak Reflow Temperature (C): | 240 °C (464 °F) |
No. of Macro Cells: | 64 |
Power Supplies (V): | 1.5/3.3,1.8 V |