Xilinx - XC2S150E-6FGG676C

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XC2S150E-6FGG676C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2S150E-6FGG676C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: B; No. of Terminals: 676; Package Code: FBGA; Package Shape: SQUARE;
Datasheet XC2S150E-6FGG676C Datasheet
In Stock484
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Organization: 864 CLBS, 52000 Gates
Maximum Combinatorial Delay of a CLB: 0.47 ns
Maximum Seated Height: 2.44 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 676
No. of Equivalent Gates: 52000
Package Style (Meter): Grid Array, Fine Pitch
JESD-30 Code: S-PBGA-B676
Maximum Clock Frequency: 357 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: FBGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial Extended
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
No. of CLBs: 864
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Length: 27 mm
Form Of Terminal: B
Additional Features: Maximum usable gates = 150000
Pitch Of Terminal: 1 mm
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