Xilinx - XC2S150E-6FTG256I

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XC2S150E-6FTG256I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2S150E-6FTG256I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
Datasheet XC2S150E-6FTG256I Datasheet
In Stock131
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Organization: 864 CLBS, 52000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.47 ns
Maximum Seated Height: 2 mm
No. of Inputs: 265
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 265
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 52000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 357 MHz
Package Shape: Square
Package Code: BGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
No. of Logic Cells: 3888
No. of CLBs: 864
JESD-609 Code: e1
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 17 mm
Form Of Terminal: Ball
Additional Features: Maximum usable gates = 150000
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2/3.6,1.8 V
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