Xilinx - XC2S200E-6FT256Q

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XC2S200E-6FT256Q by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2S200E-6FT256Q
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
Datasheet XC2S200E-6FT256Q Datasheet
In Stock214
NAME DESCRIPTION
Package Body Material: Plastic
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of Inputs: 182
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 182
Position Of Terminal: Bottom
No. of Terminals: 256
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 357 MHz
Package Shape: Square
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Technology Used: CMOS
No. of Logic Cells: 5292
JESD-609 Code: e0
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Lead
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 240 °C (464 °F)
Power Supplies (V): 1.2/3.6,1.8 V
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