Xilinx - XC2S30-6CS144C

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XC2S30-6CS144C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2S30-6CS144C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet XC2S30-6CS144C Datasheet
In Stock352
NAME DESCRIPTION
Minimum Supply Voltage: 2.375 V
Package Body Material: Plastic/Epoxy
Organization: 216 CLBS, 30000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.6 ns
Maximum Seated Height: 1.2 mm
No. of Inputs: 96
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 92
Position Of Terminal: Bottom
No. of Terminals: 144
No. of Equivalent Gates: 30000
Package Style (Meter): Grid Array, Thin Profile, Fine Pitch
JESD-30 Code: S-PBGA-B144
Maximum Clock Frequency: 263 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: TFBGA
Width: 12 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 2.625 V
Nominal Supply Voltage (V): 2.5
No. of Logic Cells: 972
No. of CLBs: 216
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA144,13X13,32
Finishing Of Terminal Used: Tin Lead
Length: 12 mm
Form Of Terminal: Ball
Additional Features: Maximum usable gates 30000
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 240 °C (464 °F)
Power Supplies (V): 1.5/3.3,2.5 V
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