Xilinx - XC2S50E-6FG456C

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XC2S50E-6FG456C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2S50E-6FG456C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC2S50E-6FG456C Datasheet
In Stock266
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Organization: 384 CLBS, 23000 Gates
Maximum Combinatorial Delay of a CLB: 0.47 ns
Maximum Seated Height: 2.6 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 456
No. of Equivalent Gates: 23000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B456
Maximum Clock Frequency: 357 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial Extended
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
No. of CLBs: 384
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin Lead
Length: 23 mm
Form Of Terminal: Ball
Additional Features: Maximum usable gates = 50000
Pitch Of Terminal: 1 mm
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