Xilinx - XC2S50E-6FT256Q

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XC2S50E-6FT256Q by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2S50E-6FT256Q
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
Datasheet XC2S50E-6FT256Q Datasheet
In Stock442
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Organization: 384 CLBS, 23000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.55 mm
No. of Inputs: 182
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 178
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 23000
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 357 MHz
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: LBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Automotive
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
No. of Logic Cells: 1728
No. of CLBs: 384
JESD-609 Code: e0
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Lead
Length: 17 mm
Form Of Terminal: Ball
Additional Features: Maximum no. of gates 50000
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 240 °C (464 °F)
Power Supplies (V): 1.2/3.6,1.8 V
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