Xilinx - XC2V2000-6BG575C

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XC2V2000-6BG575C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2V2000-6BG575C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC2V2000-6BG575C Datasheet
In Stock161
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 2688 CLBS, 2000000 Gates
Maximum Combinatorial Delay of a CLB: 0.35 ns
Maximum Seated Height: 2.6 mm
No. of Inputs: 408
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 408
Position Of Terminal: Bottom
No. of Terminals: 575
No. of Equivalent Gates: 2000000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B575
Maximum Clock Frequency: 820 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Technology Used: CMOS
No. of Logic Cells: 24192
No. of CLBs: 2688
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA575,24X24,50
Finishing Of Terminal Used: Tin Lead
Length: 31 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 1.5,1.5/3.3,3.3 V
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