
Image shown is a representation only.
Manufacturer | Xilinx |
---|---|
Manufacturer's Part Number | XC2V6000-4FF1517C0765 |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN LEAD; |
Datasheet | XC2V6000-4FF1517C0765 Datasheet |
In Stock | 1,633 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | Plastic/Epoxy |
Programmable IC Type: | FPGA |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
No. of Inputs: | 1104 |
Technology Used: | CMOS |
Sub-Category: | Field Programmable Gate Arrays |
No. of Logic Cells: | 76032 |
Surface Mount: | Yes |
JESD-609 Code: | e0 |
No. of Outputs: | 1104 |
Position Of Terminal: | Bottom |
No. of Terminals: | 1517 |
Qualification: | No |
Package Equivalence Code: | BGA1517,39X39,40 |
Finishing Of Terminal Used: | Tin Lead |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B1517 |
Form Of Terminal: | Ball |
Package Shape: | Square |
Pitch Of Terminal: | 1 mm |
Package Code: | BGA |
Peak Reflow Temperature (C): | 225 °C (437 °F) |
Moisture Sensitivity Level (MSL): | 4 |
Power Supplies (V): | 1.5,1.5/3.3,3.3 V |