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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC2V8000-6BF957C |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: HBGA; Package Shape: SQUARE; |
Datasheet | XC2V8000-6BF957C Datasheet |
In Stock | 455 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.425 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 11648 CLBS, 8000000 Gates |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Combinatorial Delay of a CLB: | 0.35 ns |
Maximum Seated Height: | 3.5 mm |
No. of Inputs: | 1108 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 1108 |
Position Of Terminal: | Bottom |
No. of Terminals: | 957 |
No. of Equivalent Gates: | 8000000 |
Package Style (Meter): | Grid Array, Heat Sink/Slug |
JESD-30 Code: | S-PBGA-B957 |
Maximum Clock Frequency: | 820 MHz |
Package Shape: | Square |
Maximum Operating Temperature: | 85 °C (185 °F) |
Package Code: | HBGA |
Width: | 40 mm |
Moisture Sensitivity Level (MSL): | 4 |
Grading Of Temperature: | Other |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.575 V |
Nominal Supply Voltage (V): | 1.5 |
Technology Used: | CMOS |
No. of Logic Cells: | 11648 |
No. of CLBs: | 11648 |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 °C (32 °F) |
Qualification: | No |
Package Equivalence Code: | BGA957,31X31,50 |
Finishing Of Terminal Used: | Tin/Lead (Sn63Pb37) |
Length: | 40 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1.27 mm |
Peak Reflow Temperature (C): | 225 °C (437 °F) |
Power Supplies (V): | 1.5,1.5/3.3,3.3 V |