Xilinx - XC2V8000-6BFG957C

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XC2V8000-6BFG957C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2V8000-6BFG957C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: HBGA; Package Shape: SQUARE;
Datasheet XC2V8000-6BFG957C Datasheet
In Stock1,367
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 11648 CLBS, 8000000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.35 ns
Maximum Seated Height: 3.5 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 957
No. of Equivalent Gates: 8000000
Package Style (Meter): Grid Array, Heat Sink/Slug
JESD-30 Code: S-PBGA-B957
Maximum Clock Frequency: 820 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: HBGA
Width: 40 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Technology Used: CMOS
No. of CLBs: 11648
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 40 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
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