Xilinx - XC2VP30-6FFG1152I

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XC2VP30-6FFG1152I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2VP30-6FFG1152I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 644;
Datasheet XC2VP30-6FFG1152I Datasheet
In Stock256
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 3424 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.32 ns
Maximum Seated Height: 3.4 mm
No. of Inputs: 644
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 644
Position Of Terminal: Bottom
No. of Terminals: 1152
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1152
Maximum Clock Frequency: 1200 MHz
Package Shape: Square
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Technology Used: CMOS
No. of Logic Cells: 30816
No. of CLBs: 3424
JESD-609 Code: e1
Qualification: No
Package Equivalence Code: BGA1152,34X34,40
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
Power Supplies (V): 1.5,1.5/3.3,2/2.5,2.5 V
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