Xilinx - XC2VP4-6FGG456I

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XC2VP4-6FGG456I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2VP4-6FGG456I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;
Datasheet XC2VP4-6FGG456I Datasheet
In Stock214
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 752 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.32 ns
Maximum Seated Height: 2.6 mm
No. of Inputs: 248
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 248
Position Of Terminal: Bottom
No. of Terminals: 456
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B456
Maximum Clock Frequency: 1200 MHz
Package Shape: Square
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Technology Used: CMOS
No. of Logic Cells: 6768
No. of CLBs: 752
JESD-609 Code: e1
Qualification: No
Package Equivalence Code: BGA456,22X22,40
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 23 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
Power Supplies (V): 1.5,1.5/3.3,2/2.5,2.5 V
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