Xilinx - XC2VP4-8FF672C

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XC2VP4-8FF672C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2VP4-8FF672C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC2VP4-8FF672C Datasheet
In Stock161
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 752 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 2.65 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 672
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B672
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Technology Used: CMOS
No. of CLBs: 752
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 220 °C (428 °F)
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