
Image shown is a representation only.
Manufacturer | Xilinx |
---|---|
Manufacturer's Part Number | XC2VP50-7FF1517I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY; |
Datasheet | XC2VP50-7FF1517I Datasheet |
In Stock | 490 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.425 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 5904 CLBS |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Combinatorial Delay of a CLB: | 0.28 ns |
Maximum Seated Height: | 3.4 mm |
No. of Inputs: | 852 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 852 |
Position Of Terminal: | Bottom |
No. of Terminals: | 1517 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B1517 |
Maximum Clock Frequency: | 1350 MHz |
Package Shape: | Square |
Package Code: | BGA |
Width: | 40 mm |
Moisture Sensitivity Level (MSL): | 4 |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.575 V |
Nominal Supply Voltage (V): | 1.5 |
Technology Used: | CMOS |
No. of Logic Cells: | 53136 |
No. of CLBs: | 5904 |
JESD-609 Code: | e0 |
Qualification: | No |
Package Equivalence Code: | BGA1517,39X39,40 |
Finishing Of Terminal Used: | Tin/Lead (Sn63Pb37) |
Length: | 40 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 225 °C (437 °F) |
Power Supplies (V): | 1.5,1.5/3.3,2/2.5,2.5 V |