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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC2VP50-7FFG1517I |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS; |
| Datasheet | XC2VP50-7FFG1517I Datasheet |
| In Stock | 1,141 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.425 V |
| Package Body Material: | Plastic/Epoxy |
| Organization: | 5904 CLBS |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| Maximum Combinatorial Delay of a CLB: | 0.28 ns |
| Maximum Seated Height: | 3.4 mm |
| Surface Mount: | Yes |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 1517 |
| Package Style (Meter): | Grid Array |
| JESD-30 Code: | S-PBGA-B1517 |
| Maximum Clock Frequency: | 1350 MHz |
| Package Shape: | Square |
| Package Code: | BGA |
| Width: | 40 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 1.575 V |
| Nominal Supply Voltage (V): | 1.5 |
| Technology Used: | CMOS |
| No. of CLBs: | 5904 |
| JESD-609 Code: | e1 |
| Qualification: | No |
| Finishing Of Terminal Used: | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
| Length: | 40 mm |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | 1 mm |
| Peak Reflow Temperature (C): | 245 °C (473 °F) |









