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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC2VP50-8BFG957I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.575 V; |
Datasheet | XC2VP50-8BFG957I Datasheet |
In Stock | 312 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.425 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 5648 CLBS |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Seated Height: | 3.5 mm |
Surface Mount: | Yes |
Position Of Terminal: | Bottom |
No. of Terminals: | 957 |
Package Style (Meter): | Grid Array, Heat Sink/Slug |
JESD-30 Code: | S-PBGA-B957 |
Package Shape: | Square |
Package Code: | HBGA |
Width: | 40 mm |
Moisture Sensitivity Level (MSL): | 4 |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.575 V |
Nominal Supply Voltage (V): | 1.5 |
Technology Used: | CMOS |
No. of CLBs: | 5648 |
JESD-609 Code: | e1 |
Qualification: | No |
Finishing Of Terminal Used: | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Length: | 40 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1.27 mm |
Peak Reflow Temperature (C): | 245 °C (473 °F) |