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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC2VPX70-7FF1704I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN LEAD; |
Datasheet | XC2VPX70-7FF1704I Datasheet |
In Stock | 359 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.425 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 8272 CLBS |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Combinatorial Delay of a CLB: | 0.28 ns |
Maximum Seated Height: | 3.45 mm |
No. of Inputs: | 992 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 992 |
Position Of Terminal: | Bottom |
No. of Terminals: | 1704 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B1704 |
Maximum Clock Frequency: | 1350 MHz |
Package Shape: | Square |
Package Code: | BGA |
Width: | 42.5 mm |
Moisture Sensitivity Level (MSL): | 4 |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.575 V |
Nominal Supply Voltage (V): | 1.5 |
Technology Used: | CMOS |
No. of Logic Cells: | 74448 |
No. of CLBs: | 8272 |
JESD-609 Code: | e0 |
Qualification: | No |
Package Equivalence Code: | BGA1704,42X42,40 |
Finishing Of Terminal Used: | Tin Lead |
Length: | 42.5 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 225 °C (437 °F) |
Power Supplies (V): | 1.5,1.5/3.3,2/2.5,2.5 V |