Xilinx - XC3090-100PG175BSPC0107

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XC3090-100PG175BSPC0107 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC3090-100PG175BSPC0107
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: PIN/PEG; No. of Terminals: 175; Package Code: PGA; Package Shape: SQUARE;
Datasheet XC3090-100PG175BSPC0107 Datasheet
In Stock459
NAME DESCRIPTION
Package Body Material: Ceramic, Metal-Sealed Cofired
Organization: 320 CLBS, 5000 Gates
Maximum Combinatorial Delay of a CLB: 7 ns
Maximum Seated Height: 3.81 mm
Surface Mount: No
Position Of Terminal: Perpendicular
No. of Terminals: 175
No. of Equivalent Gates: 5000
Package Style (Meter): Grid Array
JESD-30 Code: S-CPGA-P175
Maximum Clock Frequency: 100 MHz
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: PGA
Width: 42.164 mm
Grading Of Temperature: Military
Programmable IC Type: FPGA
Nominal Supply Voltage (V): 5
Technology Used: CMOS
No. of CLBs: 320
Minimum Operating Temperature: -55 °C (-67 °F)
Qualification: No
Length: 42.164 mm
Form Of Terminal: Pin/Peg
Additional Features: 928 flip-flops; typical gates = 5000-6000
Pitch Of Terminal: 2.54 mm
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