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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC3090-50PG175BSPC0109 |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: PIN/PEG; No. of Terminals: 175; Package Code: PGA; Package Shape: SQUARE; |
| Datasheet | XC3090-50PG175BSPC0109 Datasheet |
| In Stock | 1,245 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 4.5 V |
| Package Body Material: | Ceramic, Metal-Sealed Cofired |
| Organization: | 320 CLBS, 9000 Gates |
| Maximum Combinatorial Delay of a CLB: | 14 ns |
| Maximum Seated Height: | 3.5052 mm |
| Surface Mount: | No |
| Position Of Terminal: | Perpendicular |
| No. of Terminals: | 175 |
| No. of Equivalent Gates: | 9000 |
| Package Style (Meter): | Grid Array |
| JESD-30 Code: | S-CPGA-P175 |
| Maximum Clock Frequency: | 50 MHz |
| Package Shape: | Square |
| Maximum Operating Temperature: | 125 °C (257 °F) |
| Package Code: | PGA |
| Width: | 42.164 mm |
| Grading Of Temperature: | Military |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 5.5 V |
| Nominal Supply Voltage (V): | 5 |
| Technology Used: | CMOS |
| No. of CLBs: | 320 |
| Minimum Operating Temperature: | -55 °C (-67 °F) |
| Qualification: | No |
| Length: | 42.164 mm |
| Form Of Terminal: | Pin/Peg |
| Additional Features: | MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C |
| Pitch Of Terminal: | 2.54 mm |









