Xilinx - XC3S1000-5FT256I

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XC3S1000-5FT256I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC3S1000-5FT256I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Datasheet XC3S1000-5FT256I Datasheet
In Stock371
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Programmable IC Type: FPGA
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of Inputs: 173
Technology Used: CMOS
Sub-Category: Field Programmable Gate Arrays
No. of Logic Cells: 17280
Surface Mount: Yes
JESD-609 Code: e0
No. of Outputs: 173
Position Of Terminal: Bottom
No. of Terminals: 256
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Lead
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B256
Form Of Terminal: Ball
Package Shape: Square
Pitch Of Terminal: 1 mm
Package Code: BGA
Peak Reflow Temperature (C): 225 °C (437 °F)
Moisture Sensitivity Level (MSL): 3
Power Supplies (V): 1.2,1.2/3.3,2.5 V
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Pricing (USD)

Qty. Unit Price Ext. Price
371 $11.250 $4,173.750

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