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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC3S1600E-4FGG400CS1 |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | XC3S1600E-4FGG400CS1 Datasheet |
| In Stock | 1,403 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.14 V |
| Package Body Material: | Plastic/Epoxy |
| Organization: | 3688 CLBS, 1600000 Gates |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| Maximum Combinatorial Delay of a CLB: | 0.76 ns |
| Maximum Seated Height: | 2.43 mm |
| No. of Inputs: | 304 |
| Sub-Category: | Field Programmable Gate Arrays |
| Surface Mount: | Yes |
| No. of Outputs: | 232 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 400 |
| No. of Equivalent Gates: | 1600000 |
| Package Style (Meter): | Grid Array |
| JESD-30 Code: | S-PBGA-B400 |
| Maximum Clock Frequency: | 572 MHz |
| Package Shape: | Square |
| Maximum Operating Temperature: | 85 °C (185 °F) |
| Package Code: | BGA |
| Width: | 21 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Grading Of Temperature: | Other |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 1.26 V |
| Nominal Supply Voltage (V): | 1.2 |
| Technology Used: | CMOS |
| No. of Logic Cells: | 33192 |
| No. of CLBs: | 3688 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 °C (32 °F) |
| Qualification: | No |
| Package Equivalence Code: | BGA400,20X20,40 |
| Finishing Of Terminal Used: | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
| Length: | 21 mm |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | 1 mm |
| Peak Reflow Temperature (C): | 250 °C (482 °F) |
| Power Supplies (V): | 1.2,1.2/3.3,2.5 V |









