Xilinx - XC3S250E-4FTG256C

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XC3S250E-4FTG256C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC3S250E-4FTG256C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
Datasheet XC3S250E-4FTG256C Datasheet
In Stock58
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 612 CLBS, 250000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.76 ns
Maximum Seated Height: 1.55 mm
No. of Inputs: 172
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 132
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 250000
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 572 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: LBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Other Names: 122-1482
XC3S250E4FTG256C
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 5508
No. of CLBs: 612
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 17 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2,1.2/3.3,2.5 V
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