Xilinx - XC3S400-4FGG456C

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XC3S400-4FGG456C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC3S400-4FGG456C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC3S400-4FGG456C Datasheet
In Stock856
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 896 CLBS, 400000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.61 ns
Maximum Seated Height: 2.6 mm
No. of Inputs: 264
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 264
Position Of Terminal: Bottom
No. of Terminals: 456
No. of Equivalent Gates: 400000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B456
Maximum Clock Frequency: 630 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 8064
No. of CLBs: 896
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA456,22X22,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 23 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
Power Supplies (V): 1.2,1.2/3.3,2.5 V
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