Xilinx - XC3S400AN-4FGG676I

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XC3S400AN-4FGG676I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC3S400AN-4FGG676I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
Datasheet XC3S400AN-4FGG676I Datasheet
In Stock87
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 896 CLBS, 400000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 4.88 ns
Maximum Seated Height: 2.6 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 676
No. of Equivalent Gates: 400000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B676
Maximum Clock Frequency: 667 MHz
Package Shape: Square
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of CLBs: 896
JESD-609 Code: e1
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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