Xilinx - XC3S50-4FTG256C

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XC3S50-4FTG256C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC3S50-4FTG256C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
Datasheet XC3S50-4FTG256C Datasheet
In Stock275
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 192 CLBS, 50000 Gates
Maximum Seated Height: 1.55 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 50000
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B256
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: LBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
No. of CLBs: 192
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Length: 17 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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